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Laser dicing/ drilling in silicon, glass, sapphire, ceramics, metal and other material, is widely used in semiconductors, MEMS, LED, RFID, NFC, and so on.

Deli has launched several production job for these application, as well as many prototyping jobs.

 
                 LED sapphire wafer dicing  

                    sapphire substrate scribing

         Silicon wafer drilling


Glass-silicon bonding wafer cutting，0.5mm thick glass+ 0.24mm silicon


               The job shop

       Mass production management

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Wafer dicing and micro drilling

• Brand: Deli Laser Solutions
• Product Code: Wafer dicing and micro drilling
• Reward Points: 700
• Availability: In Stock

• $500.00

• Ex Tax: $500.00